Shenzhen, China – June 20, 2025 - Shenzhen ASCENDIoT Technology Co., Ltd, a leading innovator in RFID and IoT solutions, has successfully resolved a longstanding industry challenge: the stable and reliable embedding of RFID chips during the plastic moulding process.
The issue has long plagued manufacturers, particularly in high-temperature or high-pressure environments where conventional RFID chips often suffer damage or signal interference when molded directly into plastic parts. This problem has limited RFID integration in key sectors such as automotive, industrial tools, and smart packaging.
ASCENDIoT's technical team has developed a proprietary chip encapsulation and positioning solution, which ensures both chip integrity and signal performance during injection moulding. The company reports that the new method enables RFID tags to withstand extreme moulding conditions without compromising read/write functionality.
"We're proud to be the first in the region to offer a stable and scalable solution for RFID integration at the moulding stage," said Tao Ning, the Chief Hardware Engineer . "This breakthrough unlocks new possibilities for smart manufacturing and lifecycle tracking in embedded RFID applications."
The company is currently rolling out the solution to its major OEM clients and says it will make the technology available to industry partners later this year.
Shenzhen ASCENDIoT continues to advance its position as a full-stack RFID manufacturer and solution provider, specializing in custom RFID design, industrial integration, and high-performance tagging.
About ASCENDIoT
Shenzhen ASCENDIoT Technology Co., Ltd is a high-tech enterprise focused on the R&D and manufacturing of RFID tags, smart hardware, and IoT solutions, serving industries such as logistics, retail, healthcare, and industrial automation.