1. Various forms. A wide variety of resins, curing agents, and modifier systems are available to suit virtually every application's form requirements, ranging from very low viscosities to high melting point solids.
2. Easy to cure. Using a variety of curing agents, epoxy resin systems can be cured in the temperature range of 0 to 180 °C.
3. Strong adhesion. The existence of polar hydroxyl and ether bonds inherent in the molecular chain of epoxy resin makes it have high adhesion to various substances. Epoxy resins have low shrinkage when cured and generate little internal stress, which also contributes to improved adhesion strength.
4. Low shrinkage. The reaction of the epoxy resin and the curing agent used is carried out by direct addition reaction or ring-opening polymerization of epoxy groups in the resin molecule, without the release of water or other volatile by-products. Compared with unsaturated polyester resins and phenolic resins, they show very low shrinkage (less than 2%) during curing.
5. Mechanical properties. The cured epoxy resin system has excellent mechanical properties.
6. Electrical properties. The cured epoxy resin system is an excellent insulating material with high dielectric properties, surface leakage resistance and arc resistance.
7. Chemical stability. Generally, cured epoxy resin systems have excellent alkali, acid and solvent resistance. Like other properties of cured epoxy systems, chemical stability also depends on the selected resin and curing agent. Appropriate selection of epoxy resin and curing agent can make it have special chemical stability.
8. Dimensional stability. The combination of many of the above properties gives epoxy resin systems outstanding dimensional stability and durability.
9. Mold resistant. Cured epoxy systems are resistant to most molds and can be used in harsh tropical conditions.